Tent Through Hole PCB
Prevent the flow of resin such as sealing resin after component mounting and flux during mounting!
The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole section using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：三和電子サーキット
- 価格：Other
